Display Module Assembly and Packaging Engineer - Drive Innovation in Next-Generation Apple Products

Job Title: Job Description:

Join our dynamic team as a Display Module Assembly and Packaging Engineer and play a pivotal role in shaping the future of display technology. Based in our remote office, you will collaborate with cross-functional teams and suppliers to develop and validate cutting-edge display hardware for the next generation of Apple products. With a strong focus on mechanical and module master specifications, optical package design, and assembly process development, you will drive engineering excellence from concept to mass production.

As a key member of our display module team, you will be responsible for:

• Defining and developing mechanical and module master specifications, and driving rigorous validation plans to meet performance requirements.
• Designing new display optical packages with unique module and system-level performance, cost, and footprint requirements.
• Leading multi-functional teams to iterate design, set clear goals and priorities, and drive display module design convergence.
• Identifying and assessing critical metrics affecting display performance, analyzing experimental and build data, and addressing process limitations.
• Communicating effectively across the organization, influencing other teams, managing risk, and making decisions with limited information.
• Traveling to support build at component, module, and system factories during critical new product introduction phases.

Requirements: * BS with 3+ years of semiconductor packaging/assembly experience * M.S or Ph.D. in Mechanical Engineering, Physics, Materials Science, Electrical Engineering, or similar fields (preferred) * Prior optical packaging experience with camera/CMOS image sensor module, LED, photodiode, and optical component integrations and system interactions (preferred) * Solid fundamentals in electrical/material/thermal/mechanical engineering fields * Familiarity with various sophisticated package configurations and assembly/substrate technology (wirebond, CoWoS, BGA, POP, etc.) * Experience with TSV, 2D/2.5D, and 3D package connection (preferred) * Substrate manufacturing process, structure, design rules, and material property (preferred) What We Offer: * Competitive salary range: $143,100 - $264,200 * Opportunity to become an Apple shareholder through discretionary employee stock programs * Comprehensive medical and dental coverage * Retirement benefits * Range of discounted products and free services * Reimbursement for certain educational expenses related to advancing your career at Apple * Discretionary bonuses or commission payments (eligible roles) * Relocation assistance (eligible roles) Join Our Team: Apple is an equal opportunity employer committed to inclusion and diversity. We take affirmative action to ensure equal opportunity for all applicants without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or other legally protected characteristics. Apply To This Job Apply for this job